The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

May. 30, 2019
Applicant:

Dai-ichi Seiko Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventor:

Masataka Muro, Ogori, JP;

Assignee:

DAI-ICHI SEIKO CO., LTD., Kyoto-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/6581 (2011.01); H01R 13/627 (2006.01); H01R 13/405 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6581 (2013.01); H01R 13/405 (2013.01); H01R 13/6273 (2013.01);
Abstract

Plural contacts include other ends on which first substrate connections that are connected to the signal electrodes of a substrate are formed. A shell includes an upper plate that covers the whole of the plural contacts on the substrate. Side plates block both ends of the first substrate connections in an array direction (x-axis direction) between the upper plate and the substrate and include edges which face the substrate and on which second substrate connections connected to the ground electrode of the substrate are formed. A back plate blocks the fronts of the first substrate connections with respect to contactors between the upper plate and the substrate and includes an edge which faces the substrate and on which third substrate connections connected to the ground electrode of the substrate are formed.


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