The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Oct. 06, 2017
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventor:

Hajime Watanabe, Yokkaichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); C23F 1/00 (2006.01); C25D 3/30 (2006.01); C25D 3/50 (2006.01); C25D 5/10 (2006.01); C25D 5/48 (2006.01); C25D 7/00 (2006.01); H01B 1/02 (2006.01); H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C23F 1/00 (2013.01); C25D 3/30 (2013.01); C25D 3/50 (2013.01); C25D 5/10 (2013.01); C25D 5/48 (2013.01); C25D 7/00 (2013.01); H01B 1/02 (2013.01); H01R 43/16 (2013.01);
Abstract

A connection terminal in which alloy particles made of an intermetallic compound containing tin and palladium are exposed on an outermost surface of a contact configured to electrically contact a mating conductor and distributed on a surface of a base material at least in the contact, wherein: a tin part made of pure tin or an alloy having a higher ratio of tin to palladium than the intermetallic compound is not exposed on a plane passing through a point where a height of the alloy particles from the surface of the base material is highest.


Find Patent Forward Citations

Loading…