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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10804450 B1

PDFFull Text
Date of Patent:
Oct. 13, 2020

Filed:

Nov. 14, 2016

Method of making layered structure with metal layers using resist patterns and electrolytic plating

Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Akinori Yoneda, Anan, JP;

Hirofumi Kawaguchi, Tokushima, JP;

Kouichiroh Deguchi, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Kevin Parendo

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/40 (2010.01); H01L 33/38 (2010.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/03 (2013.01); H01L 24/04 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/38 (2013.01); H01L 33/405 (2013.01); H01L 33/44 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03472 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A manufacturing method of a flip-chip nitride semiconductor light emitting element includes a step of providing a nitride semiconductor light emitting element structure; a protective layer forming step; a first resist pattern forming step; a protective layer etching step; a first metal layer forming step; a first resist pattern removing step; a third metal layer forming step; a second resist pattern forming step; a second metal layer forming step; a second resist pattern removing step; and a third metal layer removing step.

Find Patent Forward Citations

Yoneda, Akinori. (2020). Method of making layered structure with metal layers using resist patterns and electrolytic plating (U.S. Patent No. 10804450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10804450

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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