The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Dec. 04, 2018
Nichia Corporation, Anan-shi, Tokushima, JP;
Koji Abe, Tokushima, JP;
Tomohisa Kishimoto, Anan, JP;
NICHIA CORPORATION, Anan-shi, JP;
Abstract
A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at an upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis. The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.