The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Aug. 30, 2017
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventor:

Eiji Muramoto, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/24 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 24/94 (2013.01); H01L 33/0095 (2013.01); H01L 33/24 (2013.01); H01L 33/38 (2013.01); H01L 33/62 (2013.01); H01L 33/007 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for manufacturing a light emitting element includes: forming a semiconductor structure on a first substrate; providing a second substrate configured to be bonded above a side of the semiconductor structure opposite the first substrate; forming a metal layer above at least one of (i) a side of the semiconductor structure opposite the first substrate, and/or (ii) a side of the second substrate that is to be located closer to the semiconductor structure; bonding the second substrate above the semiconductor structure via a bonding member; removing the first substrate from the semiconductor structure to obtain a bonded body in which the second substrate is bonded above the semiconductor structure; and singulating the bonded body.


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