The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Mar. 27, 2019
Applicant:

Protec Co., Ltd., Gyeonggi-do, KR;

Inventors:

Youn Sung Ko, Chungcheongnam-do, KR;

Yoshiaki Yukimori, Kanagawa, JP;

Assignee:

PROTEC CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01L 23/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 3/0623 (2013.01); B23K 3/082 (2013.01); H01L 2224/75611 (2013.01); H01L 2224/75621 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75725 (2013.01); H01L 2224/75745 (2013.01);
Abstract

Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.


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