The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Mar. 14, 2019
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventors:
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); B22F 1/00 (2006.01); H01B 1/22 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); H01L 21/52 (2006.01); C22C 1/05 (2006.01); H01L 23/051 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); B22F 1/0059 (2013.01); B22F 7/064 (2013.01); B22F 7/08 (2013.01); H01B 1/22 (2013.01); H01L 21/52 (2013.01); H01L 23/3675 (2013.01); H01L 23/48 (2013.01); H01L 24/83 (2013.01); C22C 1/05 (2013.01); H01L 23/051 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 2224/325 (2013.01); H01L 2224/33 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/0455 (2013.01); H01L 2924/04563 (2013.01); H01L 2924/0535 (2013.01); H01L 2924/0536 (2013.01);
Abstract
A semiconductor device includes: a mounting member having an electrode; a conductive member facing the electrode; and a bonding member electrically and mechanically connecting the electrode and the conductive member. The bonding member is made of a sintered body in which an additive particle including a metal atom having aggregation energy higher than a silver atom is added to an silver particle.