The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

May. 03, 2017
Applicant:

Linxens Holding, Mantes la Jolie, FR;

Inventors:

Cyril Proye, Magnanville, FR;

Eric Eymard, Polignac, FR;

Assignee:

Linxens Holding, Mantes la Jolie, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); G06K 19/077 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); G06K 19/07722 (2013.01); G06K 19/07747 (2013.01); G06K 19/07754 (2013.01); G06K 19/07769 (2013.01); H01L 21/4857 (2013.01); H01L 23/49811 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/08052 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80801 (2013.01);
Abstract

The invention relates to a chip card manufacturing method. According to this method, there are produced on the one hand, a module including a substrate supporting contacts on one face, and bonding pads on the other, on the other hand, an antenna on a support. The ends of the antenna are linked to lands of connection lands receiving a drop of soldering material on a connection portion. In order to make the soldered electrical connection between the module and the antenna reliable, the bonding pads extend over a zone covering a surface area less than that of the connection portions. The invention relates also to a chip card whose module includes bonding pads extending over a zone covering a surface area less than that of the connection portions.


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