The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Feb. 25, 2019
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Minato-ku, Tokyo, JP;
Minoru Takizawa, Sagamihara Kanagawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Abstract
A circuit apparatus according to an embodiment includes: a wiring substrate having a wiring; a first electronic component provided on the wiring substrate; a second electronic component provided on the wiring substrate, the second electronic component having a height higher than a height of the first electronic component; a sealing member provided on the wiring substrate, the sealing member covering the first electronic component and the second electronic component, a first distance between a first surface of the sealing member above the first electronic component and the wiring substrate being shorter than a second distance between a second surface of the sealing member above the second electronic component and the wiring substrate; and a conductive member provided on the sealing member, the conductive member exposing the second surface, a third distance between a third surface of the conductive member provided above the first electronic component and the wiring substrate being equal to the second distance, and a film thickness of the conductive member at the third surface being thicker than a film thickness of the conductive member at a fourth surface provided between the third surface and the second surface.