The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Jun. 13, 2016
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Mamoru Yamagami, Kyoto, JP;
Yasuhiro Fuwa, Kyoto, JP;
Hideaki Yanagida, Kyoto, JP;
Takafumi Okada, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/3107 (2013.01); H01L 23/49811 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/96 (2013.01); H05K 1/16 (2013.01); H05K 1/162 (2013.01); H05K 1/18 (2013.01); H05K 1/185 (2013.01); H05K 1/186 (2013.01); H05K 2201/10492 (2013.01);
Abstract
A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.