The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Oct. 08, 2018
Applicant:

Actron Technology Corporation, Taoyuan, TW;

Inventor:

Hsin-Chang Tsai, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/367 (2013.01); H01L 24/45 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

A package structure of a power device includes a substrate having a first circuit, a first power device, a second power device, an insulation film having a second circuit, at least one electronic component, and a package. The first power device, the second power device, and the insulation film are disposed on the substrate. The first power device and the second power device are directly electrically connected to each other via the first circuit of the substrate. The electronic component is disposed on the insulation film. The package encapsulates the substrate, the first power device, the second power device, and the electronic component.


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