The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Dec. 13, 2017
Applicant:
Abb Power Grids Switzerland Ag, Baden, CH;
Inventor:
Muhammad Nawaz, Bro, SE;
Assignee:
ABB Power Grids Switzerland AG, Baden, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/051 (2006.01); H01L 23/367 (2006.01); H01L 23/62 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3738 (2013.01); H01L 23/051 (2013.01); H01L 23/367 (2013.01); H01L 23/62 (2013.01); H01L 24/72 (2013.01); H01L 2224/72 (2013.01);
Abstract
The invention is concerned with a semiconductor power module comprising an electrically and thermally conductive base plate () and a semiconductor chip () and where a first layer of graphene () is placed between the semiconductor chip () and the base plate () in electrical and thermal contact with a first side the base plate (). Thereby the cooling of the semiconductor power module is improved.