The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Aug. 24, 2018
Applicant:

Hitachi High-tech Corporation, Minato-ku, Tokyo, JP;

Inventors:

Tooru Aramaki, Tokyo, JP;

Kenetsu Yokogawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32568 (2013.01); H01J 37/32715 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01J 2237/334 (2013.01); H01L 21/6831 (2013.01);
Abstract

The reliability of a plasma processing apparatus can be improved, and the yield of plasma processing can be improved. A plasma etching apparatushas a susceptor ringcovering the surface of a sample stage, a conductor ringdisposed in the interior of the susceptor ringand to which second high frequency electric power is supplied from a second high frequency power source, and an electric power supply connectorconfiguring a path for supplying the second high frequency electric power to the conductor ring. Further, the electric power supply connectorincludes a plate springdisposed in the interior of an insulating bossdisposed in a through holeof the sample stage and having resiliency in such a manner that the plate springis connected to an upper terminaland a lower terminal, is biased in an up-down direction P, and is expanded and contracted.


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