The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Sep. 15, 2016
Applicant:
General Electric Company, Schenectady, NY (US);
Inventors:
Thomas Robert Raber, East Berne, NY (US);
Vance Scott Robinson, Schenectady, NY (US);
Yong Liang, Niskayuna, NY (US);
Assignee:
Baker Hughes, a GE Company, LLC, Houston, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01J 35/08 (2006.01); B32B 15/20 (2006.01); B32B 9/04 (2006.01); B32B 7/12 (2006.01); H01J 35/10 (2006.01); H01J 35/12 (2006.01); B32B 7/04 (2019.01); B32B 7/02 (2019.01); B32B 7/10 (2006.01); B32B 9/00 (2006.01); B32B 15/04 (2006.01); B32B 37/06 (2006.01);
U.S. Cl.
CPC ...
H01J 35/08 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 7/10 (2013.01); B32B 7/12 (2013.01); B32B 9/007 (2013.01); B32B 9/04 (2013.01); B32B 9/041 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); H01J 35/108 (2013.01); H01J 35/12 (2013.01); B32B 37/06 (2013.01); B32B 2255/00 (2013.01); B32B 2307/302 (2013.01); B32B 2307/40 (2013.01); B32B 2307/732 (2013.01); B32B 2309/022 (2013.01); B32B 2311/00 (2013.01); B32B 2313/04 (2013.01); B32B 2457/00 (2013.01); H01J 2235/084 (2013.01); H01J 2235/088 (2013.01); H01J 2235/1291 (2013.01);
Abstract
Fabrication of a multi-layer X-ray source is disclosed using bulk structures to fabricate a multi-layer target structure. In one implementation, layers of X-ray generating material, such as tungsten, are interleaved with thermally conductive layers, such as diamond layers. To prevent delamination of the layers, various mechanical, chemical, and/or structural approaches may also be employed.