The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Jan. 25, 2020
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Hitoshi Tamura, Ninomiya, JP;

Takako Hayakawa, Hiratsuka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 33/14 (2006.01); G11B 5/10 (2006.01); G11B 25/04 (2006.01); G11B 33/02 (2006.01);
U.S. Cl.
CPC ...
G11B 33/1466 (2013.01); G11B 5/10 (2013.01); G11B 5/102 (2013.01); G11B 25/043 (2013.01); G11B 33/027 (2013.01); G11B 33/14 (2013.01); G11B 33/1446 (2013.01);
Abstract

Approaches to patching a leaky hermetically-sealed device include the use of a laminate rework patch that includes an adhesive tape layer, an aluminum sheet layer, and an outer cover layer, and whereby a viscous adhesive is injected or otherwise applied between the patch and the device leak location, over a layer of primer material, to fill the leak and stop the leakage of gas from inside the device. The thickness of the viscous adhesive, and thus the curing time and temperature of the viscous adhesive, can be managed by way of the thickness of the adhesive tape layer.


Find Patent Forward Citations

Tamura, Hitoshi. (2020). Sealed electronic component rework patch (U.S. Patent No. 10803908). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10803908

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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