The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Feb. 27, 2019
Applicant:

Tpk Touch Solutions Inc., Taipei, TW;

Inventors:

Chao-Sung Li, Hsinchu, TW;

Ho-Hsun Chi, Hsinchu County, TW;

Fang Fang, Xiamen, CN;

Zheng-Pang Huang, Fujian Province, CN;

Chien-Hsien Yu, Zhubei, TW;

Chih-Min Chen, Taichung, TW;

Shan-Yu Wu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/30 (2006.01); G06F 3/041 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0007 (2013.01); G03F 7/30 (2013.01); G06F 3/041 (2013.01); G06F 3/0443 (2019.05); H05K 3/027 (2013.01); H05K 3/064 (2013.01); G06F 3/0445 (2019.05); G06F 3/0446 (2019.05); G06F 3/04164 (2019.05); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); H05K 2203/0793 (2013.01);
Abstract

The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.


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