The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Oct. 27, 2016
Applicant:

Korea Research Institute of Standards and Science, Daejeon, KR;

Inventors:

Young-Pyo Hong, Cheongju-si, KR;

Hyunji Koo, Daejeon, KR;

No-Weon Kang, Daejeon, KR;

Dong-Joon Lee, Seoul, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 35/00 (2006.01); G01R 27/28 (2006.01); G01R 29/08 (2006.01); G01R 31/28 (2006.01); H01L 23/498 (2006.01); G01R 31/319 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
G01R 27/28 (2013.01); G01R 29/08 (2013.01); G01R 29/0892 (2013.01); G01R 31/2853 (2013.01); G01R 31/319 (2013.01); G01R 31/3191 (2013.01); G01R 35/00 (2013.01); H01L 23/49827 (2013.01); H01L 23/538 (2013.01);
Abstract

An electromagnetic wave impedance measuring apparatus includes a network analyzer, configured to measure scattering parameters according to a frequency, including a first port and a second port; and a multilayer substrate, connected to the first port and the second port by a coaxial cable, having a via connecting conductive layers to each other and including three or more conductive layers including at least an uppermost layer, a lowermost layer, and an intermediate layer. The multilayer substrate includes a test sample disposed between the uppermost layer and the lowermost layer; a through calibration standard disposed between the uppermost layer and the lowermost layer; a reflect calibration standard disposed between the uppermost layer and the lowermost layer; and a line calibration standard disposed between the uppermost layer and the lowermost layer. Each of the test sample, the through calibration standard, the reflect calibration standard, and the line calibration standard is connected by a first error box, having the via, and a second error box having the via of the same structure as the via of the first error box.


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