The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Jun. 03, 2016
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Benjamin Stassen Cook, Addison, TX (US);
Mehmet Aslan, Sunnyvale, CA (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/22 (2006.01); B82Y 30/00 (2011.01); G01N 31/22 (2006.01); H01L 21/02 (2006.01); H01L 21/288 (2006.01); H01L 21/321 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
G01N 27/223 (2013.01); B82Y 30/00 (2013.01); G01N 27/226 (2013.01); G01N 27/228 (2013.01); G01N 31/222 (2013.01); H01L 21/02288 (2013.01); H01L 21/288 (2013.01); H01L 21/321 (2013.01); H01L 28/60 (2013.01);
Abstract
An integrated circuit (IC) with an impedance sensor fabricated on a surface of the substrate is disclosed. The impedance sensor includes a bottom conductive plate formed on the substrate. A sensing membrane is formed on the bottom conductive plate. A top conductive plate is formed on the sensing membrane, in which the top conductive plate is a fusion of conductive nanoparticles having a random three dimensional porosity that is permeable to a reagent.