The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

May. 04, 2017
Applicant:

Linde Aktiengesellschaft, Munich, DE;

Inventors:

Heinz Posselt, Bad Aibling, DE;

Marko Parkkonen, Ytterby, SE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F17C 3/10 (2006.01); F17C 1/12 (2006.01); F17C 13/00 (2006.01);
U.S. Cl.
CPC ...
F17C 3/10 (2013.01); F17C 1/12 (2013.01); F17C 13/001 (2013.01); F17C 2201/0109 (2013.01); F17C 2201/0166 (2013.01); F17C 2201/035 (2013.01); F17C 2201/054 (2013.01); F17C 2203/032 (2013.01); F17C 2203/035 (2013.01); F17C 2203/0308 (2013.01); F17C 2203/0312 (2013.01); F17C 2203/0316 (2013.01); F17C 2203/0345 (2013.01); F17C 2203/0366 (2013.01); F17C 2203/0387 (2013.01); F17C 2203/0391 (2013.01); F17C 2203/0629 (2013.01); F17C 2203/0643 (2013.01); F17C 2221/014 (2013.01); F17C 2221/017 (2013.01); F17C 2223/0161 (2013.01); F17C 2223/033 (2013.01); F17C 2227/0381 (2013.01); F17C 2260/033 (2013.01); F17C 2270/01 (2013.01);
Abstract

The invention relates to a transport container () for helium (He), comprising an inner container () for receiving the liquid (He), an insulation element () that is provided on the exterior of the inner container (), a coolant container () for receiving a cryogenic liquid (N), an outer container () in which the inner container () and the coolant container () are received, and a thermal shield () which can be actively cooled with the aid of the cryogenic liquid (N) and in which the inner container () is received, wherein a peripheral gap () is provided between the insulation element () and the thermal shield (), and said insulation element () comprises a copper layer () that faces the thermal shield ().


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