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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10800947 B1

PDFFull Text
Date of Patent:
Oct. 13, 2020

Filed:

May. 10, 2017

Release layer including at least one fluorosilicon compound

Applicant:

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Ginam Kim, Midland, MI (US);

Junying Liu, Midland, MI (US);

Assignee:

Dow Silicones Corporation, Midland, MI (US);

Attorney:
Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
B32B 37/12 (2006.01); C09J 7/40 (2018.01); C09D 183/14 (2006.01); C09D 183/04 (2006.01); C09J 7/38 (2018.01); C09J 5/00 (2006.01); H01L 21/683 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C09J 7/401 (2018.01); B32B 37/12 (2013.01); C09D 183/04 (2013.01); C09D 183/14 (2013.01); C09J 5/00 (2013.01); C09J 7/38 (2018.01); H01L 21/6836 (2013.01); B32B 2457/20 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C09J 2203/318 (2013.01); C09J 2203/326 (2013.01); C09J 2427/005 (2013.01); C09J 2483/00 (2013.01); C09J 2483/005 (2013.01);
Abstract

Various embodiments disclosed related to a release layer including at least one fluorosilicon compound, and to related aspects such as methods for display device substrate processing. In various embodiments is a method of processing a display device substrate. The method can include securing the display device substrate to a carrier substrate with an adhesive delamination layer and a release layer between the adhesive delamination layer and the display device substrate. The release layer includes a cured product of a precursor release layer composition. The precursor release layer composition includes at least one fluorosilicon compound.

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