The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Apr. 25, 2017
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventor:
Thomas M. Goida, Windham, NH (US);
Assignee:
Analog Devices, Inc., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01C 5/06 (2006.01); H01L 29/84 (2006.01); B81B 7/00 (2006.01); H01L 23/24 (2006.01); H01L 23/20 (2006.01); H01L 23/49 (2006.01); H01L 23/538 (2006.01); H01L 23/50 (2006.01); H01L 23/04 (2006.01); H01L 23/00 (2006.01); G01L 19/14 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0051 (2013.01); B81B 7/0006 (2013.01); B81B 7/0048 (2013.01); B81B 7/0074 (2013.01); G01C 5/06 (2013.01); G01L 9/0042 (2013.01); G01L 9/0054 (2013.01); G01L 19/145 (2013.01); G01L 19/147 (2013.01); H01L 23/041 (2013.01); H01L 23/20 (2013.01); H01L 23/24 (2013.01); H01L 23/49 (2013.01); H01L 23/50 (2013.01); H01L 23/538 (2013.01); H01L 23/562 (2013.01); H01L 29/84 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); H01L 23/3121 (2013.01); H01L 23/49861 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/181 (2013.01);
Abstract
An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.