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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10800585 B1

PDFFull Text
Date of Patent:
Oct. 13, 2020

Filed:

Jun. 24, 2015

Manufacturing method for metal cap

Applicant:

Nippon Closures Co., Ltd., Tokyo, JP;

Inventors:

Kouichi Tsuchiya, Kanagawa, JP;

Mitsuo Kumata, Kanagawa, JP;

Yusuke Okubo, Kanagawa, JP;

Assignee:

NIPPON CLOSURES CO., LTD., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Matthew J Daniels

Assistant Examiner:

Patrick Butler

Int. Cl.
CPC ...
B29C 43/18 (2006.01); B65D 41/04 (2006.01); B65D 41/34 (2006.01); B65D 41/32 (2006.01); B65D 53/06 (2006.01); B29C 43/14 (2006.01); B21D 51/50 (2006.01); B29C 43/00 (2006.01); B29K 21/00 (2006.01); B29K 23/00 (2006.01); B29K 705/00 (2006.01); B29L 31/26 (2006.01); B29L 31/56 (2006.01);
U.S. Cl.
CPC ...
B65D 53/06 (2013.01); B21D 51/50 (2013.01); B29C 43/003 (2013.01); B29C 43/146 (2013.01); B29C 43/18 (2013.01); B65D 41/0428 (2013.01); B65D 41/325 (2013.01); B65D 41/348 (2013.01); B29C 2043/185 (2013.01); B29K 2021/003 (2013.01); B29K 2023/12 (2013.01); B29K 2705/00 (2013.01); B29L 2031/26 (2013.01); B29L 2031/565 (2013.01);
Abstract

A metal cap in which a linear to be held to a cap body and separable from the cap body can be formed by a series of operations for forming the cap body and press molding the liner. The liner of the metal cap has a double-layer structure including a barrier layer on a top panel wall side and a sealing layer on the inner side of the cap body, and the barrier layer is temporarily bonded to the top panel wall with a weak adhesive at the time of molding the barrier layer and separated from the top panel wall by the natural cooling of the barrier layer after molding.

Find Patent Forward Citations

Tsuchiya, Kouichi. (2020). Manufacturing method for metal cap (U.S. Patent No. 10800585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10800585

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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