The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Jan. 24, 2017
Applicant:

Bell Helicopter Textron Inc., Fort Worth, TX (US);

Inventors:

Suvankar Mishra, Carrollton, TX (US);

Robert Mark Chris, Dallas, TX (US);

Michael D. Ishmael, Bedford, TX (US);

Ronald J. Turner, Fort Worth, TX (US);

Assignee:

Bell Textron Inc., Fort Worth, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/12 (2006.01); B32B 37/06 (2006.01); B32B 41/00 (2006.01); B32B 27/38 (2006.01); B32B 27/28 (2006.01); B32B 7/04 (2019.01); B32B 5/02 (2006.01); B32B 3/06 (2006.01); B32B 27/16 (2006.01); B32B 7/08 (2019.01); B32B 7/02 (2019.01); B32B 27/12 (2006.01); B32B 3/20 (2006.01);
U.S. Cl.
CPC ...
B32B 3/12 (2013.01); B32B 3/06 (2013.01); B32B 3/20 (2013.01); B32B 5/02 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 7/08 (2013.01); B32B 27/12 (2013.01); B32B 27/16 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/38 (2013.01); B32B 37/06 (2013.01); B32B 41/00 (2013.01); B32B 2250/40 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2307/54 (2013.01); B32B 2307/544 (2013.01); B32B 2307/546 (2013.01); B32B 2307/552 (2013.01); B32B 2307/558 (2013.01); B32B 2307/712 (2013.01); B32B 2307/732 (2013.01); B32B 2309/02 (2013.01); B32B 2309/68 (2013.01); B32B 2439/00 (2013.01); B32B 2439/62 (2013.01); B32B 2603/00 (2013.01); B32B 2605/00 (2013.01); B32B 2605/12 (2013.01); B32B 2605/18 (2013.01); B32B 2607/00 (2013.01);
Abstract

In accordance with one embodiment of the present disclosure, a method for manufacturing a honeycomb core sandwich panel includes placing a thermoset facesheet in contact with a thermoplastic honeycomb core without using a separate adhesive and attaching the thermoset facesheet to the thermoplastic honeycomb core by using a curing profile comprising a temperature that is lower than a gel point temperature of the thermoset facesheet and higher than a softening point temperature of the thermoplastic honeycomb core.


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