The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Nov. 09, 2018
Applicant:

Granat Research, Ltd., Jerusalem, IL;

Inventor:

Michael Zenou, Hashmonaim, IL;

Assignee:

Granat Research, Ltd., Jerusalem, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/14 (2014.01); B23K 26/342 (2014.01); B23K 26/146 (2014.01); B23K 26/082 (2014.01); C23C 14/28 (2006.01); C23C 14/04 (2006.01); B23K 26/067 (2006.01); B41J 2/04 (2006.01); B23K 26/073 (2006.01); C23C 14/24 (2006.01); B41J 2/14 (2006.01); B22F 3/105 (2006.01); B23K 26/0622 (2014.01); B33Y 40/00 (2020.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B23K 26/147 (2013.01); B22F 3/1055 (2013.01); B23K 26/0622 (2015.10); B23K 26/0676 (2013.01); B23K 26/0736 (2013.01); B23K 26/082 (2015.10); B23K 26/14 (2013.01); B23K 26/146 (2015.10); B23K 26/1476 (2013.01); B23K 26/342 (2015.10); B41J 2/04 (2013.01); B41J 2/14104 (2013.01); C23C 14/048 (2013.01); C23C 14/246 (2013.01); C23C 14/28 (2013.01); B22F 2003/1056 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B41J 2202/04 (2013.01);
Abstract

Systems and methods for additive manufacturing, and, in particular, such methods and apparatus as employ pulsed lasers or other heating arrangements to create metal droplets from donor metal micro wires, which droplets, when solidified in the aggregate, form 3D structures. A supply of metal micro wire is arranged so as to be fed towards a nozzle area by a piezo translator. Near the nozzle, an end portion of the metal micro wire is heated (e.g., by a laser pulse or an electric heater element), thereby causing the end portion of the metal micro wire near the nozzle area to form a droplet of metal. A receiving substrate is positioned to receive the droplet of metal jetted from the nozzle area.


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