The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Aug. 26, 2016
Applicant:

Preco, Inc., Somerset, WI (US);

Inventors:

Daniel B. Miller, Roberts, WI (US);

Jeffrey L. Kulibert, Somerset, WI (US);

James J. Bucklew, Somerset, WI (US);

Thomas P. Gates, New Richmond, WI (US);

Assignee:

PRECO, INC., Somerset, WI (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/08 (2014.01); B23K 26/364 (2014.01); B23K 26/16 (2006.01); B23K 26/38 (2014.01); B23K 103/00 (2006.01); B23K 101/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0846 (2013.01); B23K 26/16 (2013.01); B23K 26/364 (2015.10); B23K 26/38 (2013.01); B23K 26/0838 (2013.01); B23K 2101/16 (2018.08); B23K 2103/42 (2018.08);
Abstract

A laser processing system includes a metal platform having a metal surface wherein at least a portion of the platform surface is substantially planar with a substantially smooth topography. A laser source is configured to generate a laser beam having a focal point that is directed toward a substantially planar portion of the platform surface. A motion mechanism is configured to move at least one of the metal platform and the focal point along at least one axis. A restraining mechanism restrains a film against the platform surface such that an adjoining surface of the restrained film remains in intimate contact with the surface. A controller is configured to operate the laser source, the motion mechanism or both to cut the restrained film in a predetermined pattern with a generated laser beam such that the cut does not extend through the adjoining surface of the restrained film.


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