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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10799937 B1

PDFFull Text
Date of Patent:
Oct. 13, 2020

Filed:

Apr. 20, 2017

Component mounting system and component mounting method

Applicant:

Kawasaki Jukogyo Kabushiki Kaisha, Kobe-shi, Hyogo, JP;

Inventors:

Kenji Kasahara, Gifu, JP;

Shuhei Segawa, Aisai, JP;

Kazunori Hara, Kakogawa, JP;

Yuki Takayama, Akashi, JP;

Assignee:

KAWASAKI JUKOGYO KABUSHIKI KAISHA, Kobe-shi, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jermie E Cozart

Int. Cl.
CPC ...
B21J 15/10 (2006.01); B64F 5/10 (2017.01); B64C 1/00 (2006.01); B23P 19/10 (2006.01); B64C 1/06 (2006.01); B21J 15/14 (2006.01); B23P 23/04 (2006.01); B21J 15/28 (2006.01); B21J 15/02 (2006.01); B25J 9/16 (2006.01); B25J 11/00 (2006.01); B21J 15/36 (2006.01); B21J 15/42 (2006.01); B25J 19/02 (2006.01); B25J 13/08 (2006.01); B23P 19/12 (2006.01); B23P 19/04 (2006.01); B21J 15/32 (2006.01); B21J 15/30 (2006.01);
U.S. Cl.
CPC ...
B21J 15/10 (2013.01); B21J 15/02 (2013.01); B21J 15/142 (2013.01); B21J 15/28 (2013.01); B21J 15/36 (2013.01); B21J 15/42 (2013.01); B23P 19/04 (2013.01); B23P 19/10 (2013.01); B23P 19/12 (2013.01); B23P 23/04 (2013.01); B25J 9/1697 (2013.01); B25J 11/005 (2013.01); B25J 11/007 (2013.01); B25J 13/08 (2013.01); B25J 13/086 (2013.01); B25J 19/022 (2013.01); B25J 19/023 (2013.01); B64C 1/00 (2013.01); B64C 1/06 (2013.01); B64C 1/061 (2013.01); B64F 5/10 (2017.01); B21J 15/30 (2013.01); B21J 15/32 (2013.01); B23P 2700/01 (2013.01);
Abstract

A component mounting system for mounting a component to a frame member by a fastener, and includes: a machining apparatus configured to machine a hole in each of the frame member and the component along a machining axis and fasten the frame member and the component together by the fastener; a positioning unit configured to perform positioning of a mounting position present on the frame member relative to the machining axis; a robot configured to transfer the component to the mounting position present on the frame member; and a detector including a camera and a sensor, the camera being provided on the machining axis and configured to capture an image of the component transferred to the mounting position, the sensor being configured to detect a tilt of the component transferred to the mounting position.

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