The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Nov. 28, 2014
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Takuma Nishimoto, Tokyo, JP;

Yutaka Igarashi, Tokyo, JP;

Toru Yazaki, Tokyo, JP;

Kengo Imagawa, Tokyo, JP;

Yusaku Katsube, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); A61B 8/14 (2006.01); B06B 1/06 (2006.01); G01S 15/89 (2006.01); B06B 1/02 (2006.01); G10K 11/34 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4488 (2013.01); A61B 8/4444 (2013.01); A61B 8/4494 (2013.01); B06B 1/0215 (2013.01); B06B 1/0622 (2013.01); G01S 15/8925 (2013.01); G01S 15/8927 (2013.01); G10K 11/346 (2013.01); A61B 8/14 (2013.01); A61B 8/4405 (2013.01); B06B 2201/76 (2013.01);
Abstract

Provided are an ultrasound probe, an element circuit thereof, and an ultrasound diagnostic device, whereby high image quality is possible and reduced size and lower cost are made possible. Provided is an ultrasound probe, comprising: a 2-D array transducer wherein a plurality of transducers are arrayed two-dimensionally; and a 2-D array IC in which are formed, upon an IC substrate, drive circuits which are disposed upon each of the transducers of the 2-D array transducer to drive each of the transducers at different timings with a prescribed delay quantity, and common current sources which supply drive current to the transducers of the 2-D array transducer. The number n of the common current sources which are formed upon the IC substrate is fewer than the number N of the drive circuits which are formed upon the IC substrate.


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