The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Sep. 20, 2016
Applicant:

University of Utah Research Foundation, Salt Lake City, UT (US);

Inventors:

Sandeep Negi, Salt Lake City, UT (US);

Rajmohan Bhandari, Salt Lake City, UT (US);

Assignee:

University of Utah Research Foundation, Salt Lake City, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/04 (2006.01); A61M 37/00 (2006.01); A61N 1/05 (2006.01); A61B 5/00 (2006.01); A61B 5/0478 (2006.01); A61B 5/145 (2006.01);
U.S. Cl.
CPC ...
A61B 5/04001 (2013.01); A61B 5/0478 (2013.01); A61B 5/685 (2013.01); A61B 5/6868 (2013.01); A61M 37/0015 (2013.01); A61N 1/0551 (2013.01); A61B 5/14542 (2013.01); A61B 2562/046 (2013.01); A61M 2037/0053 (2013.01); A61M 2037/0061 (2013.01); A61M 2205/3303 (2013.01); A61M 2205/3317 (2013.01); A61M 2210/0693 (2013.01);
Abstract

A multi-site electrode array () can include a microneedle array and a set of electrically active sites (). The microneedle array includes a plurality of microneedles () supported on a base substrate (). The set of electrically active sites () can be arranged at and/or near the tip of each microneedle (), and in many cases along a shaft of the microneedles. Further, at least a portion of the active sites () can be independently electrically addressable such that a remaining portion of the active sites () are optionally electrically shunted together. In some cases all of the active sites () are independently electrically addressable.


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