The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Aug. 22, 2017
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Kei Oikawa, Kawasaki, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); B29C 33/38 (2006.01); G03B 17/02 (2006.01); B29C 45/37 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0243 (2013.01); B29C 33/3842 (2013.01); B29C 45/372 (2013.01); G03B 17/02 (2013.01); B29C 2945/761 (2013.01); B29C 2945/7616 (2013.01); B29C 2945/7626 (2013.01); B29C 2945/7629 (2013.01); B29L 2031/3481 (2013.01); G03B 2217/002 (2013.01);
Abstract
There is provided a resin molded product including a hairline pattern having small roughness and high gloss. The resin molded product includes a surface having a hairline pattern in which a plurality of ridges extending in an X direction is arranged in a Y direction, thus the plurality of ridges includes a plurality of first ridges and a plurality of second ridges higher than the first ridges, with the hairline pattern having a maximum height Ry of 6 [μm] or less in the X direction, and an arithmetic average curvature Spc of apex points of 625 [1/mm] or less.