The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Aug. 09, 2017
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Inventors:
Steven Manuel, San Mateo, CA (US);
Sajid Sadi, San Jose, CA (US);
Curtis Aumiller, San Jose, CA (US);
Thomas Brenner, Sunnyvale, CA (US);
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E05D 11/08 (2006.01); E05F 1/12 (2006.01); H05K 5/02 (2006.01); H04M 1/02 (2006.01); E05B 65/00 (2006.01); E05C 19/16 (2006.01); E05D 1/00 (2006.01); E05D 3/12 (2006.01); E05D 7/00 (2006.01); E05D 11/06 (2006.01); E05D 11/10 (2006.01); E05F 3/20 (2006.01); F16C 11/04 (2006.01); F16C 11/12 (2006.01); G06F 1/16 (2006.01); E05C 17/00 (2006.01); E05B 63/00 (2006.01); E05D 11/00 (2006.01); H01F 7/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0226 (2013.01); E05B 65/0067 (2013.01); E05C 19/16 (2013.01); E05D 1/00 (2013.01); E05D 3/122 (2013.01); E05D 7/00 (2013.01); E05D 11/06 (2013.01); E05D 11/1028 (2013.01); E05F 1/12 (2013.01); E05F 3/20 (2013.01); F16C 11/04 (2013.01); F16C 11/12 (2013.01); G06F 1/1681 (2013.01); H04M 1/0216 (2013.01); E05B 63/0008 (2013.01); E05C 17/025 (2013.01); E05D 11/0081 (2013.01); E05F 1/1253 (2013.01); E05Y 2900/606 (2013.01); G06F 1/1679 (2013.01); G06F 1/1683 (2013.01); H01F 7/0205 (2013.01); H04M 1/022 (2013.01);
Abstract
A device can include a hinge mechanism rotatably coupling a first portion of the device to a second portion of the device. The hinge mechanism is configured to automatically open the device. The device can also include a damper configured to control a rate at which the hinge mechanism automatically opens the device. The hinge mechanism can include a spine hinge, a rolling contact hinge, a film hinge, or a geared link hinge.