The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Mar. 30, 2016
Applicant:

Kaneka Corporation, Osaka-shi, JP;

Inventors:

Seiji Hosogai, Otsu, JP;

Hiroyuki Ushiro, Otsu, JP;

Junpei Saito, Otsu, JP;

Kazuhiro Ono, Otsu, JP;

Assignee:

KANEKA CORPORATION, Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 27/28 (2006.01); H05K 3/02 (2006.01); B29C 65/02 (2006.01); B29C 65/00 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 37/18 (2006.01); H05K 1/03 (2006.01); B29K 679/00 (2006.01); B29L 31/34 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); B29C 65/02 (2013.01); B29C 66/45 (2013.01); B29C 66/71 (2013.01); B29C 66/74281 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 37/182 (2013.01); B29K 2679/085 (2013.01); B29K 2995/0046 (2013.01); B29L 2031/3425 (2013.01); B32B 2307/51 (2013.01); B32B 2311/12 (2013.01); B32B 2379/08 (2013.01); B32B 2457/08 (2013.01); H05K 1/028 (2013.01); H05K 1/036 (2013.01); H05K 1/0393 (2013.01); H05K 3/4655 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0154 (2013.01);
Abstract

A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380° C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380° C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.


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