The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Oct. 30, 2017
Applicant:

Commscope, Inc. of North Carolina, Hickory, NC (US);

Inventors:

Brian J. Fitzpatrick, McKinney, TX (US);

Jeffrey Cook, Parker, TX (US);

Jitendra Hansalia, Murphy, TX (US);

Amid Ihsan Hashim, Plano, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); H05K 1/028 (2013.01); H05K 1/118 (2013.01); H05K 3/388 (2013.01); H05K 3/429 (2013.01); H05K 3/4688 (2013.01); H05K 1/0393 (2013.01); H05K 1/189 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09545 (2013.01);
Abstract

Flexible fingers for flexible printed circuits improve the crack resistance of prior art designs. The crack resistance can be improved by encapsulating the trace inside additional layers such that the outer two layers include only the lands of the through-hole, and all other copper is etched away. The crack resistance can also be improved with strategically adding copper on layers other than the trace layer including attaching is to the land of the through-hole as a stub. These two designs can be combined to include a stub trace into a four-layered design.


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