The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Feb. 28, 2019
Yazaki Corporation, Tokyo, JP;
Tomoya Sato, Shizuoka, JP;
Kazuhide Takahashi, Shizuoka, JP;
Naoki Ito, Shizuoka, JP;
Yasunori Nabeta, Shizuoka, JP;
YAZAKI CORPORATION, Minato-ku, Tokyo, JP;
Abstract
A bonding method for a conductor of an electric wire includes a conductor formed of a plurality of strands and a sheath covering the conductor such that the conductor is exposed to a predetermined length. The bonding method ultrasonically bonds the plurality of strands of the electric wire to each other using an anvil and a horn. When the strands are ultrasonically bonded to each other by clamping a part of the conductor exposed from the sheath between the anvil and the horn throughout a predetermined length and ultrasonically vibrating the horn, a distance from the anvil or the horn to the sheath of the electric wire is shorter than a length of the strands when the strand vibrates in a primary mode by ultrasonic vibration.