The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Apr. 26, 2018
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Assignee:
THE BOEING COMPANY, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/10 (2006.01); H01Q 21/06 (2006.01); H01Q 5/314 (2015.01); H01Q 5/48 (2015.01); H01Q 5/25 (2015.01); H01Q 9/20 (2006.01); H01Q 9/16 (2006.01); H01Q 9/06 (2006.01); H01Q 19/10 (2006.01); H01Q 9/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/062 (2013.01); H01Q 5/25 (2015.01); H01Q 5/314 (2015.01); H01Q 5/48 (2015.01); H01Q 9/065 (2013.01); H01Q 9/16 (2013.01); H01Q 9/20 (2013.01); H01Q 19/108 (2013.01); H01Q 9/285 (2013.01);
Abstract
A dual ultra-wideband electronically scanning antenna linear array and a method for producing same is disclosed. In one embodiment, the antenna is comprised of circuit board-based multi-layered sections with integrated feeds. A first dielectric layer or substrate has a thin metal coating on the bottom surface to form a signal ground and metal coating on the top surface where capacitively loaded radiating dipoles are etched. Each of the dipole elements are connected to an associated conductive antenna feed disposed on a bottom surface of another dielectric layer disposed below the first dielectric layer.