The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Dec. 29, 2017
Applicant:
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Munich, DE;
Inventors:
Ivan Ndip, Berlin, DE;
Tanja Braun, Berlin, DE;
Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01Q 1/22 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01Q 19/06 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/20 (2013.01); H01Q 19/062 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/96 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A wafer level package with at least one integrated antenna element includes a chip layer with at least one chip, a dielectric layer as well as an antenna layer arranged between the chip layer and the dielectric layer.