The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Oct. 06, 2017
Applicant:
Universitetet I Tromsø—norges Arktiske Universitet, Tromsø, NO;
Inventors:
Assignee:
UNIVERSITETET I TROMSØ—NORGES ARKTISKE UNIVERSITET, Tromsø, NO;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/27 (2013.01); B32B 27/06 (2006.01); C08L 27/12 (2006.01); H01L 41/053 (2006.01); H01L 41/187 (2006.01); H01L 41/193 (2006.01); H01L 41/29 (2013.01); H04R 17/00 (2006.01); H01L 41/083 (2006.01); H01L 41/23 (2013.01); H01L 41/45 (2013.01); H01L 41/37 (2013.01); H01L 41/00 (2013.01); H01L 41/08 (2006.01); H01L 41/16 (2006.01); B32B 15/04 (2006.01);
U.S. Cl.
CPC ...
H01L 41/27 (2013.01); B32B 27/06 (2013.01); C08L 27/12 (2013.01); H01L 41/00 (2013.01); H01L 41/053 (2013.01); H01L 41/08 (2013.01); H01L 41/083 (2013.01); H01L 41/16 (2013.01); H01L 41/187 (2013.01); H01L 41/193 (2013.01); H01L 41/23 (2013.01); H01L 41/29 (2013.01); H01L 41/37 (2013.01); H01L 41/45 (2013.01); H04R 17/005 (2013.01); B32B 15/043 (2013.01); B32B 2250/03 (2013.01); B32B 2307/20 (2013.01); B32B 2310/14 (2013.01); B32B 2405/00 (2013.01);
Abstract
A film () comprising a piezoelectric polymer () has an upper surface and a lower surface. The film has an active region comprising the piezoelectric polymer (), which extends from the upper surface of the film to the lower surface of the film. The film also comprises an adhesive sheet (), which defines part of the upper or lower surface of the film. Circuit sheets () may be bonded to the upper and lower surfaces in a lamination process to produce a laminated piezoelectric device.