The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

May. 19, 2017
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventor:

Yukitoshi Marutani, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H05K 1/02 (2006.01); H01L 25/075 (2006.01); H05K 3/46 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/647 (2013.01); H01L 25/0753 (2013.01); H05K 1/0204 (2013.01); H01L 33/62 (2013.01); H01L 33/644 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01); H05K 3/4602 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0235 (2013.01);
Abstract

A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.


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