The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Aug. 29, 2017
Applicant:

Osram Gmbh, Munich, DE;

Inventors:

Lorenzo Baldo, Glavera del Montello, IT;

Alessio Griffoni, Fossò, IT;

Federico Poggi, Venice, IT;

Assignee:

OSRAM GMBH, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 33/62 (2010.01); H05K 3/12 (2006.01); H05K 3/02 (2006.01); H05K 5/06 (2006.01); H05K 1/09 (2006.01); F21V 19/00 (2006.01); F21V 23/00 (2015.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01); H05K 3/42 (2006.01); H05K 1/18 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21V 19/005 (2013.01); F21V 23/005 (2013.01); H01L 33/005 (2013.01); H01L 33/483 (2013.01); H05K 1/095 (2013.01); H05K 3/027 (2013.01); H05K 3/12 (2013.01); H05K 3/184 (2013.01); H05K 3/242 (2013.01); H05K 3/428 (2013.01); H05K 5/06 (2013.01); F21Y 2115/10 (2016.08); H05K 1/189 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.


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