The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

May. 30, 2014
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Jesse Colin Reiherzer, Wake Forest, NC (US);

Erin R. F. Welch, Ann Arbor, MI (US);

Sung Chul Joo, Cary, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); F21V 13/02 (2006.01); F21V 23/00 (2015.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/50 (2013.01); H01L 24/97 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/1815 (2013.01); Y10T 29/49131 (2015.01);
Abstract

Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a reflective ceramic submount, at least one light emitter chip disposed over a first surface of the submount, a layer of optical conversion material disposed over portions of each of the at least one light emitter chip and the first surface of the submount, and a lens disposed over the layer of optical conversion material. The layer of optical conversion material and the lens define separate and discrete layers over the at least one light emitter chip and submount.


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