The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jan. 07, 2019
Applicant:

Ablic Inc., Chiba-shi, Chiba, JP;

Inventor:

Mitsuhiro Yoshimura, Chiba, JP;

Assignee:

ABLIC INC., Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 27/02 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01); H01L 29/16 (2006.01); H01L 29/10 (2006.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 27/3246 (2013.01); H01L 27/3279 (2013.01); H01L 29/0865 (2013.01); H01L 29/0882 (2013.01); H01L 29/1095 (2013.01); H01L 29/16 (2013.01); H01L 29/4236 (2013.01); H01L 29/7804 (2013.01); H01L 29/7813 (2013.01); H01L 51/5256 (2013.01);
Abstract

Provided is a semiconductor device, including: a drain region of a first conductivity type and a source region of the first conductivity type in a semiconductor substrate; a base region of a second conductivity type between the drain region and the source region; a base contact region of the second conductivity type in the base region; a gate electrode on the base region through a gate insulating film; a bidirectional diode overlapping with the gate electrode in a first direction perpendicular to the semiconductor substrate, and having one end electrically connected to the gate electrode and the other end electrically connected to the source region; a source metal layer electrically connected to the source region, the base contact region, and the other end of the bidirectional diode; and a gate metal layer electrically connected to the gate electrode, and overlapping with the source metal layer in the first direction.


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