The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jul. 15, 2019
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventor:

Qi Lin, Cupertino, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); G11C 7/10 (2006.01); H01L 23/48 (2006.01); G11C 8/12 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G11C 7/1078 (2013.01); G11C 8/12 (2013.01); H01L 23/481 (2013.01); H01L 25/50 (2013.01);
Abstract

An integrated circuit device having a plurality of stacked dies is described. The integrated circuit device comprises a first die of the plurality of stacked dies having an input/output element configured to receive an input signal, the first die comprising a signal driver circuit configured to provide the input signal to each die of the plurality of stacked dies and a chip select circuit for generating a plurality of chip select signals for the plurality of stacked dies; and a second die of the plurality of stacked dies coupled to the first die, the second die having a function block configured to the receive the input signal; wherein the second die receives the input signal in response to a chip select signal of the plurality of chip select signals that corresponds to the second die. A method of implementing an integrated circuit device having a plurality of stacked dies is also described.


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