The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Feb. 24, 2017
Applicant:
Osram Oled Gmbh, Regensburg, DE;
Inventor:
Jürgen Moosburger, Lappersdorf, DE;
Assignee:
OSRAM OLED GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); G09G 3/32 (2016.01); H01L 33/62 (2010.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); G09F 9/302 (2006.01); H01L 23/538 (2006.01); H01L 33/36 (2010.01); H01L 33/54 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); G09F 9/3026 (2013.01); G09G 3/32 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 33/36 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H05K 3/323 (2013.01); G09G 2300/026 (2013.01); G09G 2300/0426 (2013.01); G09G 2300/0452 (2013.01); G09G 2300/06 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83039 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 2201/10106 (2013.01);
Abstract
A video wall module includes a plurality of light emitting diode chips, each including first contact electrodes and second contact electrodes arranged at a contact side, wherein the light emitting diode chips are arranged at a top side of a multilayer circuit board, and the contact electrodes electrically conductively connect to a first metallization layer arranged at the top side of the circuit board.