The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Oct. 31, 2017
Applicants:
Imec Vzw, Leuven, BE;
Katholieke Universiteit Leuven, Leuven, BE;
Inventors:
Assignees:
IMEC vzw, Leuven, BE;
Katholieke Universiteit Leuven, Leuven, BE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H01L 24/94 (2013.01); H01L 2224/037 (2013.01); H01L 2224/03318 (2013.01); H01L 2224/03901 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8002 (2013.01); H01L 2224/80143 (2013.01); H01L 2224/80169 (2013.01); H01L 2224/80355 (2013.01); H01L 2224/80908 (2013.01); H01L 2224/80986 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83896 (2013.01);
Abstract
A method for bonding chips to a landing wafer is disclosed. In one aspect, a volume of alignment liquid is dispensed on a wettable surface of the chip so as to become attached to the surface, after which the chip is moved towards the bonding site on the wafer, the bonding site equally being provided with a wettable surface. A liquid bridge is formed between the chip and the bonding site on the substrate wafer, enabling self-alignment of the chip. Dispensing alignment liquid on the chip and not the wafer is advantageous in terms of mitigating unwanted evaporation of the liquid prior to bonding.