The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Feb. 25, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H03H 9/02 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 2/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01G 2/22 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H03H 9/02913 (2013.01);
Abstract
A circuit modulecomprises: a wiring structure; an electronic componentarranged on the upper surface of the wiring structure; an insulating resin layerwhich is provided on the upper surface of the wiring structureand in which the electronic componentis embedded; and a metal layerprovided on a side surface Sof the insulating resin layerand a side surface Sof the wiring structure. The surface roughness of the side surface Sof the insulating resin layeris expressed as R. The surface roughness of the side surface Sof the wiring structureis expressed as R. Rand Rdiffer from each other.