The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Aug. 13, 2018
Applicant:

X Display Company Technology Limited, Dublin, IE;

Inventors:

Ronald S. Cok, Rochester, NY (US);

Erich Radauscher, Raleigh, NC (US);

Salvatore Bonafede, Chapel Hill, NC (US);

Christopher Andrew Bower, Raleigh, NC (US);

Matthew Alexander Meitl, Durham, NC (US);

Carl Ray Prevatte, Jr., Raleigh, NC (US);

Brook Raymond, Cary, NC (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/66 (2006.01); H01L 33/62 (2010.01); H01L 33/38 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); H01L 22/24 (2013.01); H01L 25/075 (2013.01); H01L 33/387 (2013.01); H01L 33/62 (2013.01); H01L 33/0095 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.


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