The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Dec. 13, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hidefumi Saeki, Osaka, JP;

Atsushi Harikai, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/268 (2013.01); H01L 21/3043 (2013.01); H01L 21/3065 (2013.01); H01L 21/31144 (2013.01);
Abstract

A manufacturing process of an element chip, comprising a substrate preparing step for preparing a substrate having first and second sides opposed to each other, and including a plurality of dicing regions and element regions defined by the dicing regions, the first side being covered by a protective film, a first laser-grooving step for forming a plurality of grooves by irradiating a laser beam to the first side along the dicing regions, and a plasma-dicing step for plasma-etching the substrate along the grooves in depth through a plasma exposure, thereby to dice the substrate into a plurality of element chips, wherein the second side of the substrate and an annular frame are held on a holding sheet in the substrate preparing step, and wherein the laser beam is irradiated only in a region inside an outer edge of the substrate in the first laser-grooving step.


Find Patent Forward Citations

Loading…