The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

May. 29, 2018
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Masahito Tanabe, Annaka, JP;

Michihiro Sugo, Takasaki, JP;

Kazunori Kondo, Takasaki, JP;

Hiroyuki Yasuda, Tomioka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 183/04 (2006.01); C09J 7/10 (2018.01); C09J 5/06 (2006.01); C08G 77/20 (2006.01); C08G 77/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 5/06 (2013.01); C09J 7/10 (2018.01); C09J 183/04 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C09J 2201/36 (2013.01); C09J 2201/61 (2013.01); C09J 2203/326 (2013.01); C09J 2483/00 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A temporary adhesive film roll for substrate processing, includes: a roll axis and a composite film-shaped temporary-adhesive material for temporarily bonding a substrate to a support, the composite film-shaped temporary-adhesive material being rolled up around the roll axis; wherein the composite film-shaped temporary-adhesive material includes a first temporary adhesive layer composed of a thermoplastic resin, a second temporary adhesive layer composed of a thermosetting resin, and a third temporary adhesive layer composed of a thermosetting resin which is different from that of the second temporary adhesive layer. The temporary adhesive film roll for substrate processing is capable of giving a temporary adhesive material which facilitates temporary adhesion between a substrate and a support, rapidly forms a temporary adhesive material layer on a substrate or a support, has excellent resistance to a thermal process such as chemical vapor deposition, and is easily separated to improve the productivity of thin wafers.


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