The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Apr. 25, 2017
Applicant:
Denka Company Limited, Chuo-ku, Tokyo, JP;
Inventors:
Akimasa Yuasa, Omuta, JP;
Kouji Nishimura, Omuta, JP;
Assignee:
Denka Company Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H01L 23/15 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H05K 3/28 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/481 (2013.01); H01L 23/13 (2013.01); H01L 23/3735 (2013.01); H01L 23/49838 (2013.01); H01L 24/00 (2013.01); H05K 1/0306 (2013.01); H05K 3/28 (2013.01); H01L 21/4846 (2013.01); H01L 23/15 (2013.01); H05K 1/0203 (2013.01); H05K 1/18 (2013.01);
Abstract
Disclosed herein is a ceramic circuit substrate for a power module obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively. Also disclosed herein are methods for manufacturing a ceramic circuit substrate for a power module.