The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jul. 31, 2019
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Yuichiro Takeshima, Toyama, JP;

Masanori Nakayama, Toyama, JP;

Katsunori Funaki, Toyama, JP;

Yasutoshi Tsubota, Toyama, JP;

Hiroto Igawa, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 21/02164 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); H01L 21/02274 (2013.01); H01L 27/11582 (2013.01);
Abstract

Described herein is a technique capable of improving electrical characteristics of a semiconductor device. According to the technique, there is provided a method of manufacturing a semiconductor device including: (a) generating oxygen and hydrogen active species; and (b) forming an oxide layer by supplying the oxygen and hydrogen active species to a substrate with a concave structure to subject a film on an inner surface of the concave structure to oxidation, wherein the oxide layer is formed in (b) such that a thickness of the oxide layer is greater on the inner surface than at an upper end portion of the concave structure by setting a ratio of a flow rate of the hydrogen active species to a total flow rate to a predetermined ratio greater than a first ratio at which a rate of forming the oxide layer is maximized at the upper end portion of the concave structure.


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