The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Nov. 26, 2018
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/248 (2006.01); H01G 2/04 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 2/02 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 2/02 (2013.01); H01G 2/04 (2013.01); H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01G 4/008 (2013.01); H01G 4/1227 (2013.01); H01G 4/1245 (2013.01);
Abstract
An electronic component includes: a capacitor body; an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component; a metal frame electrically connected to the external electrode; and a bonding member disposed between the external electrode and the metal frame. The bonding member includes a tin (Sn)-based solder layer; a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.